By adopting these cooling solutions:
通過採用這些冷卻解決方案:
Air/Liquid Cooling Solution for
AI & HPC Trend
AI及HPC趨勢下的
風/液 冷卻解決方案
20kW~200kW+
With the rapid development of Artificial Intelligence (AI) and High-Performance Computing (HPC) technologies, the high-power chips equipped in GPU servers are posing great challenges to the cooling systems of traditional data centers.
To meet the ultra-high power density cooling demands ranging from 20kW to 200kW+ per rack, we REACH TECHNOLOGY are proud to introduce three innovative cooling solutions.
隨著人工智能(AI)和高性能計算(HPC)技術的快速發展,GPU 服務器所配備的高功率芯片正給傳統數據中心的冷卻系統帶來巨大挑戰.
為滿足每機櫃高達 20kW 至 200kW+ 的超高功率密度冷卻需求, 我們REACH TECHNOLOGY隆重推出三大創新冷卻解決方案.
Three air/liquid cooling solutions
三大風冷/液冷卻解決方案
1️⃣Rear Door Heat Exchanger ❄️
2️⃣Direct-to-chip / Rack Manifolds 🧊
3️⃣Immersive Cooling Tank 🛀
1️⃣背門式散熱器 ❄️
2️⃣直達晶片(D2C)液冷 / 機櫃分歧管🧊
3️⃣浸沒式冷卻 🛀
Achieve industry-leading power usage effectiveness (PUE) down to 1.05 📊
實現行業領先的電力使用效率PUE降至1.05
Extend the lifespan of your server hardware 🔋
延長伺服器硬體的使用壽命
Drastically reduce operating costs and carbon emissions 💰🌳
大幅降低運營成本和碳排放
Optimize data center layout and increase deployment density 🏢
優化數據中心佈局,提高部署密度
Contact us now to learn how to customize the best cooling solution for your advanced computing systems and drive your data center towards unprecedented energy efficiency!
立即聯繫我們，了解如何為您的運算系統量身定制最佳的冷卻方案!
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